Technical Data
| COOLER-TYPE | THERMAL-PASTE |
Description
:Advanced features include
Very high thermal conductivity of 7.5W/mK provides exceptional heat transfer between chip and cooler
No electrical conductivity
Premium formulation
Metal oxide compounds: 60%
Zinc oxide compounds: 30%
Silicone compounds: 10%
3g capacity is enough for 9 applications on average
Easily applied with provided spatula
Impressive temperature range of -50°C to +150°C
DC1 is the perfect choice for any cooling application that requires top heat transfer performance, or even just when you want something better than the generic paste your CPU or cooler came with.
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